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Samsung J200f Dead Boot Repair File

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 Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: FN12AB (0x464e31324142), rev: 0x00, serial number: 0x0257DC0F
 Manufacturing date: Oct 2016
CID: 15010046 4E313241 42000257 DC0FA348
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
 Boot acknowledge is sent during the boot operation
 Boot partition 1 is enabled for boot
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
  Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked

ANDROID System Info:
 platform: exynos3, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: universal3475, name: j2ltejv
 brand: samsung, model: SM-J200F
 build model list: SM-J200F
 build id: LMY47X, version: 5.1.1 Lollipop (LMY47X.J200FXXU2APJ1)
 build description: j2ltejv-user 5.1.1 LMY47X J200FXXU2APJ1 release-keys

Internal storage: 4.63 GiB
crypto state: unencrypted
Selected: [SAMSUNG] KMFN10012M/8GB   (BGA221)

Samsung J500h Dead Repair Dump File

Samsung Galaxy J500h Full dump

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  Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-7287
 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: QN16MB (0x514e31364d42), rev: 0x00, serial number: 0xEA91680E
 Manufacturing date: Jun 2016
CID: 15010051 4E31364D 4200EA91 680E63A4
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 512 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
 No boot acknowledge is sent (default)
 Device is not boot-enabled (default)
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked

ANDROID System Info:
 platform: msm8916, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: MSM8916, name: j53gxx
 brand: samsung, model: SM-J500H
 build model list: SM-J500H
 build id: MMB29M, version: 6.0.1 Marshmallow (MMB29M.J500HXXS2BRJ1)
 build description: j53gxx-user 6.0.1 MMB29M J500HXXS2BRJ1 release-keys

Samsung Sm J210f Emmc Repair Full Dump file

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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: QN16BB (0x514e31364242), rev: 0x00, serial number: 0x6087DC2B
 Manufacturing date: Jun 2016
CID: 15010051 4E313642 42006087 DC2B633E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)

Huawei Y5 Prime DRA-LX5 Dump Firmware

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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: FE62MB (0x464536324d42), rev: 0x06, serial number: 0x2142D4B6
 Manufacturing date: May 2018
CID: 15010046 4536324D 42062142 D4B65578
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 14.56 GiB(15,634,268,160 bytes)

Samsung Galaxy Grand Prime SM-G532F Dump File

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Init bus... VCC: 3.3 V, VCCQ: 1.8 V Bus: 1 bit (SDR 4MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)  Card/BGA: BGA (Discrete embedded) - High density MMC  Manufacturer ID: 0x90 (SK Hynix)  Product name: H8G4u (0x483847347592), rev: 0x01, serial number: 0x33C17239  Manufacturing date: Oct 2018 CID: 90014A48 38473475 920133C1 7239A594 CSD: D0270132 0F5903FF FFFFFFE7 8A40002A EXT_CSD revision: 1.7 (MMC v5.0, v5.01) Partition info:  Boot1: 4096 KiB  Boot2: 4096 KiB  RPMB: 4096 KiB  User area: 7.28 GiB(7,818,182,656 bytes)

Platform	OS	Android 6.0 (Marshmallow)
	Chipset	Mediatek MT6737T (28 nm)
	CPU	Quad-core 1.4 GHz Cortex-A53
	GPU	Mali-T720MP2

Memory	Card slot	microSD, up to 256 GB (uses shared SIM slot)
	Internal	8GB 1.5GB RAM