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Samsung J200f Dead Boot Repair File

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 Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: FN12AB (0x464e31324142), rev: 0x00, serial number: 0x0257DC0F
 Manufacturing date: Oct 2016
CID: 15010046 4E313241 42000257 DC0FA348
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Partition configuration: 0x48
 Boot acknowledge is sent during the boot operation
 Boot partition 1 is enabled for boot
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
  Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked

ANDROID System Info:
 platform: exynos3, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: universal3475, name: j2ltejv
 brand: samsung, model: SM-J200F
 build model list: SM-J200F
 build id: LMY47X, version: 5.1.1 Lollipop (LMY47X.J200FXXU2APJ1)
 build description: j2ltejv-user 5.1.1 LMY47X J200FXXU2APJ1 release-keys

Internal storage: 4.63 GiB
crypto state: unencrypted
Selected: [SAMSUNG] KMFN10012M/8GB   (BGA221)

Samsung J500h Dead Repair Dump File

Samsung Galaxy J500h Full dump

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  Connection status: EHCI:HUB:HUB:USB 2.00 High-Speed
Interface: UFI High-Speed
Serial number: 0011-8840-7287
 Boot version: 1.04, FW version: 1.13 (Aug 19 2019 23:46:09)
Insertion test... Done
Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: QN16MB (0x514e31364d42), rev: 0x00, serial number: 0xEA91680E
 Manufacturing date: Jun 2016
CID: 15010051 4E31364D 4200EA91 680E63A4
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 512 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)
Cache size: 64 MiB
Hardware reset function: 1
Partition configuration: 0x00
 No boot acknowledge is sent (default)
 Device is not boot-enabled (default)
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x00
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked

ANDROID System Info:
 platform: msm8916, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: MSM8916, name: j53gxx
 brand: samsung, model: SM-J500H
 build model list: SM-J500H
 build id: MMB29M, version: 6.0.1 Marshmallow (MMB29M.J500HXXS2BRJ1)
 build description: j53gxx-user 6.0.1 MMB29M J500HXXS2BRJ1 release-keys

Samsung Sm J210f Emmc Repair Full Dump file

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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: QN16BB (0x514e31364242), rev: 0x00, serial number: 0x6087DC2B
 Manufacturing date: Jun 2016
CID: 15010051 4E313642 42006087 DC2B633E
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 7.28 GiB(7,818,182,656 bytes)

Huawei Y5 Prime DRA-LX5 Dump Firmware

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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 8 bit (HS SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: FE62MB (0x464536324d42), rev: 0x06, serial number: 0x2142D4B6
 Manufacturing date: May 2018
CID: 15010046 4536324D 42062142 D4B65578
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.8 (MMC v5.1)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 14.56 GiB(15,634,268,160 bytes)

Samsung Galaxy Grand Prime SM-G532F Dump File

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Init bus... VCC: 3.3 V, VCCQ: 1.8 V Bus: 1 bit (SDR 4MHz) Access mode: sector mode Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)  Card/BGA: BGA (Discrete embedded) - High density MMC  Manufacturer ID: 0x90 (SK Hynix)  Product name: H8G4u (0x483847347592), rev: 0x01, serial number: 0x33C17239  Manufacturing date: Oct 2018 CID: 90014A48 38473475 920133C1 7239A594 CSD: D0270132 0F5903FF FFFFFFE7 8A40002A EXT_CSD revision: 1.7 (MMC v5.0, v5.01) Partition info:  Boot1: 4096 KiB  Boot2: 4096 KiB  RPMB: 4096 KiB  User area: 7.28 GiB(7,818,182,656 bytes)

Platform	OS	Android 6.0 (Marshmallow)
	Chipset	Mediatek MT6737T (28 nm)
	CPU	Quad-core 1.4 GHz Cortex-A53
	GPU	Mali-T720MP2

Memory	Card slot	microSD, up to 256 GB (uses shared SIM slot)
	Internal	8GB 1.5GB RAM

Samsung Galaxy J7 SM-J700H Dump file Ufi Box

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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
 Card/BGA: BGA (Discrete embedded) - High density MMC
 Manufacturer ID: 0x15 (Samsung)
 Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xEEDFFC9E
 Manufacturing date: Nov 2016
CID: 15010041 4A4E4233 5203EEDF FC9EB376
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
 Boot1: 4096 KiB
 Boot2: 4096 KiB
 RPMB: 4096 KiB
 User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x00
 No boot acknowledge is sent (default)
 Device is not boot-enabled (default)
Partitioning support: 0x07
 Device support partitioning feature
 Device can have enhanced technological features
 Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
  Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
 Power-on write protection: possible
 Permanent write protection: possible
 Lock status: not locked

ANDROID System Info:
 platform: exynos5, cpu abi: armeabi-v7a
 manufacturer: samsung
 board: universal7580, name: j7e3gxx
 brand: samsung, model: SM-J700H
 build model list: SM-J700H
 build id: MMB29K, version: 6.0.1 Marshmallow (MMB29K.J700HXXS3BQF3)
 build description: j7e3gxx-user 6.0.1 MMB29K J700HXXS3BQF3 release-keys

Internal storage: 12.14 GiB
crypto state: unencrypted
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G

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About Symphony V145: Camera Primary 5 MP, autofocus, LED flash Feature Geo-tagging, touch focus, face detection, HDR, panorama Secondary 5 MP Feature LED flash Video 3gp @30fps Memory Card microSD, up to 32 GB Internal memory 8 GB RAM 1 GB Data GPRS Yes EDGE Yes WLAN Wi-Fi 802.11 b/g/n, hotspot Bluetooth 4.2, A2DP, LE Usb microUSB 2.0 Features OS Android 8.1 Oreo (Go edition) Chipset Mediatek CPU Quad-core 1.4 GHz GPU Mali Sensor Accelerometer, proximity, compass Radio FM radio GPS Yes, with A-GPS Color Black, Champagne Gold, Glossy Blue Special Feature Battery Battery Removable Li-ion 2200 mAh battery Others

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Tecno F4 Pro Frp firmware

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general vendor
Device Manufacturer     Tecno
String
general model
Model Name     F4 Pro
String
general aliases
Additional names this device is known by     Tecno Pop 1S Pro
String CSV (most common name first)
general type
Device type     Mobile
String (eg Tablet, Mobile, Computer etc..)
general battery
Battery Information     Li-Po 3000 mAh
String CSV
general cpu
CPU and Chip information     MediaTek MT6739WA, Quad Core, 1.28GHz, ARM Cortex A53, ARM Mali-400 MP2
String CSV
general eusar
Device SAR measured at head    
String
general platform
Operating system name     Android
String
general platform version
Operating system version initially shipped with the device     8.1
String
general platform version max
Highest supported operating system version (End of life devices only)    
String
Tecno F4 Pro Device Specifications
Tecno F4 Pro Design Information
design antenna
Antenna position     Internal
String
design dimensions
Device Dimensions in mm     71.5 x 148.1 x 8.6
Number x Number x Number
design formfactor
The shape of this device     Bar
String
design keyboard
The keyboard type     Screen
String CSV (some devices may have a touch screen and keypad)
design sidekeys
Keys on the side of this device     Volume, Power
String CSV
design softkeys
Virtual keys     3
Number
design weight
Weight in grams     151.5
Number
Tecno F4 Pro Display Information
display color
Is this screen color ?     Yes
Yes or No
display colors
Number of supported colors     16M
String (eg 262K, 262144)
display other
Other characteristics of this display     Capacitive Touchscreen, Multitouch
String CSV
display pixel ratio
Native device pixel ratio     2.00
Number (eg 1.00, 1, 1.33 etc..)
display css screen sizes
Reported css screen sizes.     360x0, 720x0
String CSV (eg 320x480, 414x736)
display ppi
Display pixels per inch     293
Number
display size
Diagonal size of the display in inches     5.5
String
display type
Display technology     IPS
String
display x
Number of horizontal pixels     720
Number
display y
Number of vertical pixels     1440
Number
Tecno F4 Pro Media Information
media audio
Audio Formats     MP3, WAV
String CSV
media camera
Primary Camera Details     13MP, 4128x3096
String CSV
media other
Other media information     Autofocus, Dual LED Flash, F2.0 Aperture, Video Calling, Macro Mode, Music Player, Video Player, Fixed Focus
String CSV
media secondcamera
Secondary Camera Details     5MP, 2592x1944
String CSV
media videocapture
Video Capture Information     YES, FHD@30fps
String CSV
media videoplayback
Video Formats     MP4
String CSV
Tecno F4 Pro Other Information
connectors
List of all connectors     3.5mm Audio, MicroUSB 2.0
String CSV
network
Communications Networks     GSM850, GSM900, GSM1800, GSM1900, WCDMA900, WCDMA2100, UMTS900, UMTS2100, HSDPA900, HSDPA2100, LTE700, LTE800, LTE1800, LTE2100, LTE2600, Bluetooth 4.2, WIFI, 802.11b, 802.11g, 802.11n, GPS, A-GPS, GLONASS, EDGE, GPRS
String CSV
features
Any special features     Dual SIM, Accelerometer, Proximity Sensor, Gravity Sensor, Light Sensor, Fingerprint Sensor, Loudspeaker, Microphone, Speakerphone, Vibration, Ambient Light Sensor, Computer Sync, OTA Sync, Tethering
String CSV
memory internal
Internal Memory     16GB, 2GB RAM
String CSV
memory slot
Memory Slot Technology     MicroSD, MicroSDHC, 64GB
String CSV
Tecno F4 Pro Benchmark Information