Home Dump Files samsung j700h full dump file
j700h_Repair_Dead_Boot_EMMC_DUMP.Easy-Jtag
j700h_Repair_Dead_Boot_EMMC_DUMP.ufi box
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SAMSUNG SM-J700H(DL Mode)Dump Dead Boot Repair
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Init bus...
VCC: 3.3 V, VCCQ: 3.0 V
Bus: 1 bit (SDR 52MHz)
Access mode: sector mode
Power supply: dual-voltage (1.70-1.95V, 2.7-3.6V)
Card/BGA: BGA (Discrete embedded) - High density MMC
Manufacturer ID: 0x15 (Samsung)
Product name: AJNB3R (0x414a4e423352), rev: 0x03, serial number: 0xEEDFFC9E
Manufacturing date: Nov 2016
CID: 15010041 4A4E4233 5203EEDF FC9EB376
CSD: D0270132 0F5903FF F6DBFFEF 8E40400C
EXT_CSD revision: 1.7 (MMC v5.0, v5.01)
Partition info:
Boot1: 4096 KiB
Boot2: 4096 KiB
RPMB: 4096 KiB
User area: 14.68 GiB(15,758,000,128 bytes)
Cache size: 64 MiB
Partition configuration: 0x00
No boot acknowledge is sent (default)
Device is not boot-enabled (default)
Partitioning support: 0x07
Device support partitioning feature
Device can have enhanced technological features
Device partitioning possible
Boot configuration protection: 0x00
Boot bus conditions: 0x01
Bus width: x4 (sdr/ddr), boot mode: sdr(default), reset bus width to x1 sdr(default)
Boot area write protection: 0x00
Power-on write protection: possible
Permanent write protection: possible
Lock status: not locked
ANDROID System Info:
platform: exynos5, cpu abi: armeabi-v7a
manufacturer: samsung
board: universal7580, name: j7e3gxx
brand: samsung, model: SM-J700H
build model list: SM-J700H
build id: MMB29K, version: 6.0.1 Marshmallow (MMB29K.J700HXXS3BQF3)
build description: j7e3gxx-user 6.0.1 MMB29K J700HXXS3BQF3 release-keys
Internal storage: 12.14 GiB
crypto state: unencrypted
Detected: SAMSUNG moviNAND KMAJN000B3-RXXX/16G
